Choose your country or region.

EnglishFrançaispolskiSlovenija한국의DeutschSvenskaSlovenskáMagyarországItaliaहिंदीрусскийTiếng ViệtSuomiespañolKongeriketPortuguêsภาษาไทยБългарски езикromânescČeštinaGaeilgeעִבְרִיתالعربيةPilipinoDanskMelayuIndonesiaHrvatskaفارسیNederland繁体中文Türk diliΕλλάδαRepublika e ShqipërisëአማርኛAzərbaycanEesti VabariikEuskeraБеларусьíslenskaBosnaAfrikaansIsiXhosaisiZuluCambodiaსაქართველოҚазақшаAyitiHausaКыргыз тилиGalegoCatalàCorsaKurdîLatviešuພາສາລາວlietuviųLëtzebuergeschmalaɡasʲМакедонскиMaoriМонголулсবাংলা ভাষারမြန်မာनेपालीپښتوChicheŵaCрпскиSesothoසිංහලKiswahiliТоҷикӣاردوУкраїна
Intel
EP3SL200F1152C2 ImageView larger image
Image may be representation.
See specs for product details.

EP3SL200F1152C2

Manufacturer Part Number:
EP3SL200F1152C2
Manufacturer / Brand
Intel
Part of Description:
IC FPGA 744 I/O 1152FBGA
Datasheets:
EP3SL200F1152C2(1).pdfEP3SL200F1152C2(2).pdfEP3SL200F1152C2(3).pdfEP3SL200F1152C2(4).pdfEP3SL200F1152C2(5).pdfEP3SL200F1152C2(6).pdfEP3SL200F1152C2(7).pdf
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, Stock Available.
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: info@intel-altera.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number EP3SL200F1152C2
Manufacturer / Brand Intel
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 744 I/O 1152FBGA
Lead Free Status / RoHS Status: RoHS Compliant
Voltage - Supply 0.86V ~ 1.15V
Total RAM Bits 10901504
Supplier Device Package 1152-FBGA (35x35)
Series Stratix® III L
Package / Case 1152-BBGA, FCBGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 200000
Number of LABs/CLBs 8000
Number of I/O 744
Mounting Type Surface Mount
Base Product Number EP3SL200

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



EP3SL200F1152C2 Product Details:

"Unleashing the Power of EP3SL200F1152C2 Embedded-FPGAs: A Comprehensive Guide to Its Applications, Features, and Manufacturing Process" As one of the most versatile and efficient field-programmable gate arrays (FPGAs) today, users can rely on the EP3SL200F1152C2 to deliver unmatched performance and reliability. Classified under Integrated Circuits (ICs), this FPGA boasts a wide range of features and performance parameters that make it suitable for many electronic devices and industries. At the heart of this FPGA is its 744 I/O pins, which provide high-speed and low-jitter connectivity. The EP3SL200F1152C2 is ideal for a host of applications, including industrial control systems, medical equipment, aerospace, telecommunications, and transportation systems. With its power-efficient design and temperature range capability, this FPGA can operate in harsh environments without sacrificing performance. In terms of its manufacturing process, the EP3SL200F1152C2 undergoes a rigorous chip design, cutting, cleaning, laser processing, back grinding, doping, exposure, and more. This complex process ensures that every unit meets the highest quality standards. When it comes to different types of integrated circuits, the EP3SL200F1152C2 can handle digital, analog, mixed signal, and radio frequency (RF) signals. This versatility makes it an excellent choice for applications that require signal processing and high-speed data transfer. To ensure component quality, finished products undergo packaging and testing, which further enhances the device's durability and reliability. With its robust performance and reliable manufacturing process, the EP3SL200F1152C2 is an FPGA that users can trust. In summary, the EP3SL200F1152C2 is a powerful and versatile FPGA that can meet the demands of many applications. With its robust performance parameters, manufacturing quality, and application scenarios, it's an excellent choice for anyone looking for an FPGA that delivers uncontested performance and reliability.

You May Also Be Interested In: